Global Thin Wafers Temporary Bonding Equipment and Materials Market Growth (Status and Outlook) 2020-2025
According to this study, over the next five years the Thin Wafers Temporary Bonding Equipment and Materials market will register a xx%% CAGR in terms of revenue, the global market size will reach $ xx million by 2025, from $ xx million in 2019. In particular, this report presents the global revenue market share of key companies in Thin Wafers Temporary Bonding Equipment and Materials business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Thin Wafers Temporary Bonding Equipment and Materials market by product type, application, key manufacturers and key regions and countries.
This study specially analyses the impact of Covid-19 outbreak on the Thin Wafers Temporary Bonding Equipment and Materials, covering the supply chain analysis, impact assessment to the Thin Wafers Temporary Bonding Equipment and Materials market size growth rate in several scenarios, and the measures to be undertaken by Thin Wafers Temporary Bonding Equipment and Materials companies in response to the COVID-19 epidemic.
Segmentation by type: breakdown data from 2015 to 2020 in Section 2.3; and forecast to 2025 in section 10.7.
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding
Segmentation by application: breakdown data from 2015 to 2020, in Section 2.4; and forecast to 2025 in section 10.8.
< 100 µm Wafers
below 40µm Wafers
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
3M
DoubleCheck Semiconductors
ABB
AGC
AMD
Accretech
Crystal Solar
Cabot
Dalsa
Corning
Intel
Mitsubishi Electric
LG Innotek
1366 Technologies
Hamamatsu
ERS
Robert Bosch
IBM
Ebara
Qualcomm
Sumitomo Chemical
Samsung
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key players and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Thin Wafers Temporary Bonding Equipment and Materials market size by key regions/countries, type and application, history data from 2015 to 2019, and forecast to 2025.
To understand the structure of Thin Wafers Temporary Bonding Equipment and Materials market by identifying its various subsegments.
Focuses on the key global Thin Wafers Temporary Bonding Equipment and Materials players, to define, describe and analyze the value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Thin Wafers Temporary Bonding Equipment and Materials with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the size of Thin Wafers Temporary Bonding Equipment and Materials submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Frequently Asked Questions
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
- By Type
- By Application
- By Region
- By Country
- By Manufacturer
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size 2015-2025
2.1.2 Thin Wafers Temporary Bonding Equipment and Materials Market Size CAGR by Region
2.2 Thin Wafers Temporary Bonding Equipment and Materials Segment by Type
2.2.1 Chemical Debonding
2.2.2 Chemical Debonding
2.2.3 Mechanical Debonding
2.2.4 Laser Debonding
2.3 Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
2.3.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
2.3.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Type (2015-2020)
2.4 Thin Wafers Temporary Bonding Equipment and Materials Segment by Application
2.4.1 < 100 µm Wafers
2.4.2 below 40µm Wafers
2.5 Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
2.5.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application (2015-2020)
2.5.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Application (2015-2020)
3 Global Thin Wafers Temporary Bonding Equipment and Materials by Players
3.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Players
3.1.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Players (2018-2020)
3.1.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Players (2018-2020)
3.2 Global Thin Wafers Temporary Bonding Equipment and Materials Key Players Head office and Products Offered
3.3 Market Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) (2018-2020)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Thin Wafers Temporary Bonding Equipment and Materials by Regions
4.1 Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions
4.2 Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth
4.3 APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth
4.4 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth
4.5 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth
5 Americas
5.1 Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size by Countries
5.2 Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
5.3 Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Key Economic Indicators of Few Americas Countries
6 APAC
6.1 APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions
6.2 APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
6.3 APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Regions
7 Europe
7.1 Europe Thin Wafers Temporary Bonding Equipment and Materials by Countries
7.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
7.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Key Economic Indicators of Few Europe Countries
8 Middle East & Africa
8.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials by Countries
8.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type
8.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers and Impact
9.1.1 Growing Demand from Key Regions
9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends
10 Global Thin Wafers Temporary Bonding Equipment and Materials Market Forecast
10.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Forecast (2021-2025)
10.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecast by Regions
10.2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Forecast by Regions (2021-2025)
10.2.2 Americas Market Forecast
10.2.3 APAC Market Forecast
10.2.4 Europe Market Forecast
10.2.5 Middle East & Africa Market Forecast
10.3 Americas Forecast by Countries
10.3.1 United States Market Forecast
10.3.2 Canada Market Forecast
10.3.3 Mexico Market Forecast
10.3.4 Brazil Market Forecast
10.4 APAC Forecast by Countries
10.4.1 China Market Forecast
10.4.2 Japan Market Forecast
10.4.3 Korea Market Forecast
10.4.4 Southeast Asia Market Forecast
10.4.5 India Market Forecast
10.4.6 Australia Market Forecast
10.5 Europe Forecast by Countries
10.5.1 Germany Market Forecast
10.5.2 France Market Forecast
10.5.3 UK Market Forecast
10.5.4 Italy Market Forecast
10.5.5 Russia Market Forecast
10.5.6 Spain Market Forecast
10.6 Middle East & Africa Forecast by Countries
10.6.1 Egypt Market Forecast
10.6.2 South Africa Market Forecast
10.6.3 Israel Market Forecast
10.6.4 Turkey Market Forecast
10.6.5 GCC Countries Market Forecast
10.7 Global Thin Wafers Temporary Bonding Equipment and Materials Forecast by Type
10.8 Global Thin Wafers Temporary Bonding Equipment and Materials Forecast by Application
11 Key Players Analysis
11.1 3M
11.1.1 Company Details
11.1.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.1.4 Main Business Overview
11.1.5 3M News
11.2 DoubleCheck Semiconductors
11.2.1 Company Details
11.2.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.2.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.2.4 Main Business Overview
11.2.5 DoubleCheck Semiconductors News
11.3 ABB
11.3.1 Company Details
11.3.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.3.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.3.4 Main Business Overview
11.3.5 ABB News
11.4 AGC
11.4.1 Company Details
11.4.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.4.4 Main Business Overview
11.4.5 AGC News
11.5 AMD
11.5.1 Company Details
11.5.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.5.4 Main Business Overview
11.5.5 AMD News
11.6 Accretech
11.6.1 Company Details
11.6.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.6.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.6.4 Main Business Overview
11.6.5 Accretech News
11.7 Crystal Solar
11.7.1 Company Details
11.7.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.7.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.7.4 Main Business Overview
11.7.5 Crystal Solar News
11.8 Cabot
11.8.1 Company Details
11.8.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.8.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.8.4 Main Business Overview
11.8.5 Cabot News
11.9 Dalsa
11.9.1 Company Details
11.9.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.9.4 Main Business Overview
11.9.5 Dalsa News
11.10 Corning
11.10.1 Company Details
11.10.2 Thin Wafers Temporary Bonding Equipment and Materials Product Offered
11.10.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2018-2020)
11.10.4 Main Business Overview
11.10.5 Corning News
11.11 Intel
11.12 Mitsubishi Electric
11.13 LG Innotek
11.14 1366 Technologies
11.15 Hamamatsu
11.16 ERS
11.17 Robert Bosch
11.18 IBM
11.19 Ebara
11.20 Qualcomm
11.21 Sumitomo Chemical
11.22 Samsung
12 Research Findings and Conclusion
List of Tables
Table 1. Research Methodology
Table 2. Data Source
Table 3. Thin Wafers Temporary Bonding Equipment and Materials Market Size CAGR by Region 2015-2025 ($ Millions)
Table 4. Major Players of Chemical Debonding
Table 5. Major Players of Hot Sliding Debonding
Table 6. Major Players of Mechanical Debonding
Table 7. Major Players of Laser Debonding
Table 8. Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2014-2019) ($ Millions)
Table 9. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
Table 10. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020) ($ Millions)
Table 11. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application (2015-2020)
Table 12. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Players (2018-2020) ($ Millions)
Table 13. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Players (2018-2020)
Table 14. Global Thin Wafers Temporary Bonding Equipment and Materials Key Players Head office and Products Offered
Table 15. Thin Wafers Temporary Bonding Equipment and Materials Concentration Ratio (CR3, CR5 and CR10) (2018-2020)
Table 16. New Products and Potential Entrants
Table 17. Mergers & Acquisitions, Expansion
Table 18. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions 2015-2020 ($ Millions)
Table 19. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Regions 2015-2020
Table 20. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size by Countries (2015-2020) ($ Millions)
Table 21. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Countries (2015-2020)
Table 22. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020) ($ Millions)
Table 23. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
Table 24. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020) ($ Millions)
Table 25. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application (2015-2020)
Table 26. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size by Regions (2015-2020) ($ Millions)
Table 27. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Regions (2015-2020)
Table 28. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020) ($ Millions)
Table 29. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
Table 30. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020) ($ Millions)
Table 31. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application (2015-2020)
Table 32. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Countries (2015-2020) ($ Millions)
Table 33. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Countries (2015-2020)
Table 34. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020) ($ Millions)
Table 35. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
Table 36. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020) ($ Millions)
Table 37. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application (2015-2020)
Table 38. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Countries (2015-2020) ($ Millions)
Table 39. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Countries (2015-2020)
Table 40. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2015-2020) ($ Millions)
Table 41. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
Table 42. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2015-2020) ($ Millions)
Table 43. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application (2015-2020)
Table 44. Key and Potential Regions of Thin Wafers Temporary Bonding Equipment and Materials
Table 45. Key Application and Potential Industries of Thin Wafers Temporary Bonding Equipment and Materials
Table 46. Key Challenges of Thin Wafers Temporary Bonding Equipment and Materials
Table 47. Key Trends of Thin Wafers Temporary Bonding Equipment and Materials
Table 48. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Forecast by Regions (2021-2025) ($ Millions)
Table 49. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share Forecast by Regions
Table 50. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Forecast by Type (2021-2025) ($ Millions)
Table 51. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share Forecast by Type (2021-2025)
Table 52. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Forecast by Application (2021-2025) ($ Millions)
Table 53. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share Forecast by Application (2021-2025)
Table 54. 3M Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 55. 3M Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 56. 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 57. 3M Main Business
Table 58. 3M Latest Developments
Table 59. DoubleCheck Semiconductors Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 60. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 61. DoubleCheck Semiconductors Main Business
Table 62. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 63. DoubleCheck Semiconductors Latest Developments
Table 64. ABB Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 65. ABB Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 66. ABB Main Business
Table 67. ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 68. ABB Latest Developments
Table 69. AGC Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 70. AGC Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 71. AGC Main Business
Table 72. AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 73. AGC Latest Developments
Table 74. AMD Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 75. AMD Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 76. AMD Main Business
Table 77. AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 78. AMD Latest Developments
Table 79. Accretech Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 80. Accretech Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 81. Accretech Main Business
Table 82. Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 83. Accretech Latest Developments
Table 84. Crystal Solar Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 85. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 86. Crystal Solar Main Business
Table 87. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 88. Crystal Solar Latest Developments
Table 89. Cabot Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 90. Cabot Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 91. Cabot Main Business
Table 92. Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 93. Cabot Latest Developments
Table 94. Dalsa Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 95. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 96. Dalsa Main Business
Table 97. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 98. Dalsa Latest Developments
Table 99. Corning Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 100. Corning Thin Wafers Temporary Bonding Equipment and Materials Product Offered
Table 101. Corning Main Business
Table 102. Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue and Gross Margin (2018-2020E)
Table 103. Corning Latest Developments
Table 104. Intel Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 105. Mitsubishi Electric Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 106. LG Innotek Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 107. 1366 Technologies Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 108. Hamamatsu Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 109. ERS Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 110. Robert Bosch Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 111. IBM Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 112. Ebara Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 113. Qualcomm Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 114. Sumitomo Chemical Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
Table 115. Samsung Details, Company Total Revenue (in $ million), Head Office, Thin Wafers Temporary Bonding Equipment and Materials Major Market Areas and Its Competitors
List of Figures
Figure 1. Thin Wafers Temporary Bonding Equipment and Materials Report Years Considered
Figure 2. Market Research Methodology
Figure 3. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate 2015-2025 ($ Millions)
Figure 4. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type (2015-2020)
Figure 5. Global Chemical Debonding Market Size Growth Rate
Figure 6. Global Hot Sliding Debonding Market Size Growth Rate
Figure 7. Global Mechanical Debonding Market Size Growth Rate
Figure 8. Global Laser Debonding Market Size Growth Rate
Figure 9. Thin Wafers Temporary Bonding Equipment and Materials in < 100 µm Wafers
Figure 10. Global Thin Wafers Temporary Bonding Equipment and Materials Market: < 100 µm Wafers (2015-2020) ($ Millions)
Figure 11. Thin Wafers Temporary Bonding Equipment and Materials in below 40µm Wafers
Figure 12. Global Thin Wafers Temporary Bonding Equipment and Materials Market: below 40µm Wafers (2015-2020) ($ Millions)
Figure 13. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application in 2019
Figure 14. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Regions 2015-2020
Figure 15. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size 2015-2020 ($ Millions)
Figure 16. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size 2015-2020 ($ Millions)
Figure 17. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size 2015-2020 ($ Millions)
Figure 18. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size 2015-2020 ($ Millions)
Figure 19. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Countries in 2019
Figure 20. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type in 2019
Figure 21. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application in 2019
Figure 22. United States Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 23. Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 24. Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 25. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Regions in 2019
Figure 26. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type in 2019
Figure 27. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application in 2019
Figure 28. China Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 29. Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 30. Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 31. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 32. India Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 33. Australia Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 34. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Countries in 2019
Figure 35. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type in 2019
Figure 36. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application in 2019
Figure 37. Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 38. France Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 39. UK Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 40. Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 41. Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 42. Spain Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 43. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Countries in 2019
Figure 44. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Type in 2019
Figure 45. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Market Share by Application in 2019
Figure 46. Egypt Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 47. South Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 48. Israel Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 49. Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 50. GCC Countries Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth 2015-2020 ($ Millions)
Figure 51. Global Thin Wafers Temporary Bonding Equipment and Materials arket Size Forecast (2021-2025) ($ Millions)
Figure 52. Americas Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 53. APAC Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 54. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 55. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 56. United States Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 57. Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 58. Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 59. Brazil Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 60. China Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 61. Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 62. Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 63. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 64. India Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 65. Australia Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 66. Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 67. France Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 68. UK Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 69. Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 70. Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 71. Spain Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 72. Egypt Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 73. South Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 74. Israel Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 75. Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
Figure 76. GCC Countries Thin Wafers Temporary Bonding Equipment and Materials Market Size 2021-2025 ($ Millions)
